Entity legal name
AP BONDING SOLUTIONS PRIVATE LIMITED
LEI
EDGAR
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LEI code 98450080763C6D9D7F03
Validation status
Fully Corroborated
Entity status
Active
Legal form
YSP9
Registered by
RA000394
Registration ID
U24304PN2018PTC177793
Legal jurisdiction
IN
Headquarters address
LEI registration status
Issued
Validate on Blockchain
Registered by LOU
Last update date
2025/11/08 12:33:02 +01:00
Next renewal date
2027/01/07 11:54:02 +01:00
Validation
Fully Corroborated
Initial registration date
2022/01/07 11:54:08 +01:00
AP BONDING SOLUTIONS PRIVATE LIMITED is a company located in India, 411019 PUNE at OFF NO.18, 1ST FLOOR, HIGHWAY TOWERS, MUMBAI PUNE RD. AP BONDING SOLUTIONS PRIVATE LIMITED has an ACTIVE entity status and an ISSUED LEI code. The Legal Entity Identifier code of AP BONDING SOLUTIONS PRIVATE LIMITED is 98450080763C6D9D7F03. The legal form of this company is YSP9 and is subject to the jurisdiction of IN law.
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