Entity legal name
江苏华昇半导体材料有限公司
LEI
EDGAR
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LEI code 6556006HEQRWTGXPCT13
Validation status
Fully Corroborated
Entity status
Active
Legal form
ECAK
Registered by
RA000092
Registration ID
91320301MA1WJRJP0D
Legal jurisdiction
CN
Legal address
Headquarters address
LEI registration status
Lapsed
Validate on Blockchain
Registered by LOU
Last update date
2022/03/01 06:34:07 +01:00
Next renewal date
2022/01/04 06:27:46 +01:00
Validation
Fully Corroborated
Initial registration date
2021/01/04 06:27:46 +01:00
江苏华昇半导体材料有限公司 is a company located in China, 221000 徐州市 at 鼓楼区经济技术开发区杨山路66号. 江苏华昇半导体材料有限公司 has an ACTIVE entity status and a LAPSED LEI code. The Legal Entity Identifier code of 江苏华昇半导体材料有限公司 is 6556006HEQRWTGXPCT13. The legal form of this company is ECAK and is subject to the jurisdiction of CN law.
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