Entity legal name
CLP Global Bond Fund
LEI
EDGAR
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LEI code 549300DMFSTO2S16YP30
Validation status
Entity Supplied Only
Entity status
Active
Legal form
8888
Registered by
RA999999
Legal jurisdiction
HK
Legal address
Headquarters address
LEI registration status
Issued
Validate on Blockchain
Registered by LOU
Last update date
2024/08/09 14:12:17 +02:00
Next renewal date
2025/09/09 06:48:20 +02:00
Validation
Entity Supplied Only
Initial registration date
2015/10/31 02:02:34 +01:00
CLP Global Bond Fund is a company located in Hong Kong, 999077 Hong Kong at 18th Floor. CLP Global Bond Fund has an ACTIVE entity status and an ISSUED LEI code. The Legal Entity Identifier code of CLP Global Bond Fund is 549300DMFSTO2S16YP30. The legal form of this company is 8888 and is subject to the jurisdiction of HK law.
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