Entity legal name
武汉市建投科技小额贷款有限公司
LEI
EDGAR
More data...
Data viewer
LEI code 300300Z1697342000014
Validation status
Fully Corroborated
Entity status
Active
Legal form
ECAK
Registered by
RA000092
Registration ID
9142010006682327XK
Legal jurisdiction
CN
Legal address
Headquarters address
LEI registration status
Lapsed
Validate on Blockchain
Registered by LOU
Last update date
2022/03/01 06:34:07 +01:00
Next renewal date
2021/12/13 00:26:04 +01:00
Validation
Fully Corroborated
Initial registration date
2019/12/13 00:26:04 +01:00
武汉市建投科技小额贷款有限公司 is a company located in China, 430074 武汉市 at 武汉东湖新技术开发区鲁巷绿化广场东南侧民族大道1号光谷资本大厦二楼. 武汉市建投科技小额贷款有限公司 has an ACTIVE entity status and a LAPSED LEI code. The Legal Entity Identifier code of 武汉市建投科技小额贷款有限公司 is 300300Z1697342000014. The legal form of this company is ECAK and is subject to the jurisdiction of CN law.
This space is reserved for your company
Add your own information here
Upload your own image and add vital information about your company. It will be visible to anyone who looks up your organization!
Don't have LEI for your company?
Get it here
