Entity legal name
上海虹口东华美钻小额贷款股份有限公司
LEI
EDGAR
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LEI code 300300Z1667531000005
Validation status
Fully Corroborated
Entity status
Active
Legal form
ECAK
Registered by
RA000092
Registration ID
91310000067783791D
Legal jurisdiction
CN
Legal address
Headquarters address
LEI registration status
Lapsed
Validate on Blockchain
Registered by LOU
Last update date
2022/03/01 06:34:07 +01:00
Next renewal date
2022/01/14 05:35:15 +01:00
Validation
Fully Corroborated
Initial registration date
2020/01/14 05:35:15 +01:00
上海虹口东华美钻小额贷款股份有限公司 is a company located in China, 200080 虹口区 at 上海市虹口区四川北路848、850号5楼. 上海虹口东华美钻小额贷款股份有限公司 has an ACTIVE entity status and a LAPSED LEI code. The Legal Entity Identifier code of 上海虹口东华美钻小额贷款股份有限公司 is 300300Z1667531000005. The legal form of this company is ECAK and is subject to the jurisdiction of CN law.
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