Entity legal name
顺平县金怡科技小额贷款有限公司
LEI
EDGAR
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LEI code 300300Z1622913000048
Validation status
Fully Corroborated
Entity status
Active
Legal form
ECAK
Registered by
RA000092
Registration ID
91130636596811751Y
Legal jurisdiction
CN
Legal address
Headquarters address
LEI registration status
Lapsed
Validate on Blockchain
Registered by LOU
Last update date
2022/03/01 06:34:07 +01:00
Next renewal date
2021/12/04 06:02:40 +01:00
Validation
Fully Corroborated
Initial registration date
2019/12/04 06:02:40 +01:00
顺平县金怡科技小额贷款有限公司 is a company located in China, 068698 保定市 at 河北省顺平县中国肠衣基地. 顺平县金怡科技小额贷款有限公司 has an ACTIVE entity status and a LAPSED LEI code. The Legal Entity Identifier code of 顺平县金怡科技小额贷款有限公司 is 300300Z1622913000048. The legal form of this company is ECAK and is subject to the jurisdiction of CN law.
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