Entity legal name
成都高新区高投科技小额贷款有限公司
LEI
EDGAR
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LEI code 300300Z1554951000073
Validation status
Fully Corroborated
Entity status
Active
Legal form
ECAK
Registered by
RA000092
Registration ID
91510100057458346N
Legal jurisdiction
CN
Legal address
Headquarters address
LEI registration status
Lapsed
Validate on Blockchain
Registered by LOU
Last update date
2022/03/01 06:34:07 +01:00
Next renewal date
2022/01/15 02:22:55 +01:00
Validation
Fully Corroborated
Initial registration date
2020/01/15 02:22:55 +01:00
成都高新区高投科技小额贷款有限公司 is a company located in China, 610042 成都市 at 成都高新区锦城大道11号3层302号. 成都高新区高投科技小额贷款有限公司 has an ACTIVE entity status and a LAPSED LEI code. The Legal Entity Identifier code of 成都高新区高投科技小额贷款有限公司 is 300300Z1554951000073. The legal form of this company is ECAK and is subject to the jurisdiction of CN law.
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