Entity legal name
沈阳市北华医材有限公司
LEI
EDGAR
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LEI code 300300U6JSE47IIEND86
Validation status
Fully Corroborated
Entity status
Active
Legal form
ECAK
Registered by
RA000092
Registration ID
91210100720969987M
Legal jurisdiction
CN
Legal address
Headquarters address
LEI registration status
Lapsed
Validate on Blockchain
Registered by LOU
Last update date
2022/03/01 06:34:07 +01:00
Next renewal date
2021/07/16 07:01:53 +02:00
Validation
Fully Corroborated
Initial registration date
2020/07/16 07:01:53 +02:00
沈阳市北华医材有限公司 is a company located in China, 110000 沈阳市 at 沈阳市于洪区永旺街16号. 沈阳市北华医材有限公司 has an ACTIVE entity status and a LAPSED LEI code. The Legal Entity Identifier code of 沈阳市北华医材有限公司 is 300300U6JSE47IIEND86. The legal form of this company is ECAK and is subject to the jurisdiction of CN law.
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