Entity legal name
金发科技股份有限公司
LEI
EDGAR
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LEI code 300300SN8W1XSX4OLL19
Validation status
Fully Corroborated
Entity status
Active
Legal form
ECAK
Registered by
RA000092
Registration ID
91440101618607269R
Legal jurisdiction
CN
Legal address
Headquarters address
LEI registration status
Lapsed
Validate on Blockchain
Registered by LOU
Last update date
2023/02/21 10:50:33 +01:00
Next renewal date
2024/02/21 07:45:13 +01:00
Validation
Fully Corroborated
Initial registration date
2020/04/15 07:45:13 +02:00
金发科技股份有限公司 is a company located in China, 100000 广州市 at 广州市高新技术产业开发区科学城科丰路33号. 金发科技股份有限公司 has an ACTIVE entity status and a LAPSED LEI code. The Legal Entity Identifier code of 金发科技股份有限公司 is 300300SN8W1XSX4OLL19. The legal form of this company is ECAK and is subject to the jurisdiction of CN law.
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