Entity legal name
WUXI BOLIN ELECTRONIC MATERIALS CO.,LTD
LEI
EDGAR
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LEI code 300300I31DP79THJ0592
Validation status
Fully Corroborated
Entity status
Active
Legal form
ECAK
Registered by
RA000092
Registration ID
91320200094260611F
Legal jurisdiction
CN
Legal address
Headquarters address
LEI registration status
Lapsed
Validate on Blockchain
Registered by LOU
Last update date
2023/05/16 03:13:23 +02:00
Next renewal date
2024/05/16 02:22:13 +02:00
Validation
Fully Corroborated
Initial registration date
2020/10/15 02:22:14 +02:00
WUXI BOLIN ELECTRONIC MATERIALS CO.,LTD is a company located in China, 214045 无锡市 at 梁溪区民丰路198号1809. WUXI BOLIN ELECTRONIC MATERIALS CO.,LTD has an ACTIVE entity status and a LAPSED LEI code. The Legal Entity Identifier code of WUXI BOLIN ELECTRONIC MATERIALS CO.,LTD is 300300I31DP79THJ0592. The legal form of this company is ECAK and is subject to the jurisdiction of CN law.
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