Entity legal name
RAM Hong Kong Government Bond Fund
LEI
EDGAR
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LEI code 2549005JVA6FSGSQ7340
Validation status
Fully Corroborated
Entity status
Active
Legal form
8888
Registered by
RA000390
Registration ID
BVH346
Legal jurisdiction
HK
Legal address
Headquarters address
LEI registration status
Issued
Validate on Blockchain
Registered by LOU
Last update date
2025/10/16 18:53:52 +02:00
Next renewal date
2026/11/14 11:18:18 +01:00
Validation
Fully Corroborated
Initial registration date
2024/11/14 11:18:18 +01:00
RAM Hong Kong Government Bond Fund is a company located in Hong Kong, 999077 Hong Kong at Suite 3308, 33/F. RAM Hong Kong Government Bond Fund has an ACTIVE entity status and an ISSUED LEI code. The Legal Entity Identifier code of RAM Hong Kong Government Bond Fund is 2549005JVA6FSGSQ7340. The legal form of this company is 8888 and is subject to the jurisdiction of HK law.
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