Entity legal name
承德高新区互生科技小额贷款有限责任公司
LEI
EDGAR
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LEI code 300300Z1812913000087
Validation status
Fully Corroborated
Entity status
Active
Legal form
ECAK
Registered by
RA000092
Registration ID
911308053082917648
Legal jurisdiction
CN
Legal address
Headquarters address
LEI registration status
Lapsed
Validate on Blockchain
Registered by LOU
Last update date
2022/03/01 06:34:07 +01:00
Next renewal date
2021/12/05 04:15:15 +01:00
Validation
Fully Corroborated
Initial registration date
2019/12/05 04:15:15 +01:00
承德高新区互生科技小额贷款有限责任公司 is a company located in China, 068880 承德市 at 河北省承德市开发区凤凰御景L06-102室. 承德高新区互生科技小额贷款有限责任公司 has an ACTIVE entity status and a LAPSED LEI code. The Legal Entity Identifier code of 承德高新区互生科技小额贷款有限责任公司 is 300300Z1812913000087. The legal form of this company is ECAK and is subject to the jurisdiction of CN law.
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